半固化片 / Prepreg
導熱係數
Thermal Conductivity
規格
Specification
壓合厚度 / Cured thickness
流動度 / Resin Flow
um
%
1W/m.K
1080
80 ± 10
20 ± 10
100 ± 10
30 ± 10
可根據需求╃·▩,提供其他厚度的粘結片 / We are also able to supply HA10P with other thickness.